SM-5600
Features
- Misprints from paste and glue
- PCB Assembly and Hybrid Substrates defluxing
- Solder Pallets from the wave solder process
SM-8800
Features
- Misprints from paste and glue
- PCB Assembly and Hybrid Substrates defluxing
- Various parts ( Mechanical, optical, lead frames and wafer)
SM-7500
Features
- Metal stencial from paste and glue
- Plastic stencil from glue
- Misprints from paste and glue
- PCB Assembly and Hybrid Substrates defluxing
- Solder Pallets from the wave solder process
- Squeegee
SM-8150
Features
- Metal stencial from paste and glue
- Plastic stencil from glue
SM-8160
Features
- Metal stencial from paste and glue
- Plastic stencil from glue
SM-8100
Features
- Metal stencial from paste and glue
- Plastic stencil from glue
SM-8400N
Features
- Solder Pallets from the wave solder process
- Various parts ( Mechanical, optical, lead frames and wafer)
SM-600
Features
- Squeegee