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Laser Processing Equipment

LS2-U1-400-CS

Laser Processing Equipment

Features

  • Applicable products: FPC, PCB,CCL
  • We made software, high cutting efficiency, high throughput
  • Software made by Aurotek, Autofocus function
  • Supports Industrial 4.0
  • Sheet by sheet loading / unloading
  • 355nm Wavelength Laser system
  • Scanning area> 70 mm X 70 mm
  • Minman laser line width 15um
  • CCD positioning accuracy < 5um
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LSO 3000G

Laser Depaneling & Marking Machine

Features

    Accuracy ± 25 μm (1 Mil)
  • Axes Driving speed up to 1000mm/sec
  • Laser marking & depaneling All-in-One
  • Configurable Laser Source per demand
  • Apply to Flexible, Rigid, Flex-rigid PCB
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