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Rework

BGA/SMT Rework Station For XL PCBS

PDR IR-E6​

Features

  • Gantry Mounted Advanced Focused IR component
    heating
  • Large Quartz IR PCB preheating with 3 zones
    24”/620mm PCB Capacity
  • Split Beam prism system for simultaneous PCB/-
    component viewing
  • Precision Components Pick and Placement up to
    10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • PCB Forced Air Cooling
Simple Rework Station For All BGA/SMT Components

PDR IR-E3

Features

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with up to 3 zones
  • Split Beam prism system for simultaneous PCB/ component viewing
  • Precision Components Pick and Placement up to 10um
  • Precision PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Reflow Process Observation Camera
  • CB Forced Air Cooling

PDR IR-E2​

BGA/SMT Rework Station For Small/Medium PCBS

Features

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating with dual-zone 12”/300mm PCB Capacity
  • Split Beam prism system for simultaneous PCB/ component viewing
  • Precision Components Pick and Placement up to 10um
  • Professional PCB handling
  • Component Nest/Flux Application Facility
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control

PDR IR-E1​

Entry-Level SMD/BGA Rework Station

Features

  • Advanced Focused IR component heating
  • Quartz IR PCB preheating
  • Bench Mounted Workholder
  • Closed Loop Non-Contact Temperature Sensing
  • Advanced Automatic Thermal Process Control
  • Handheld Suction Wand

X-Ray

Genx-90P​

Ultra High-Performance, 90KV, Compact X-Ray System

Features

  • BGA Inspection/Analysis
  • Counterfeit Inspection
  • Porosity/Voiding Detection
  • Medical Device Inspection
  • Wire Bond Inspection
  • LED Inspection
  • Less Than 1 uSv/hr (0.1 mR/hr) USFDA 21 CFR-1, J-1000, 1020.40

GenX-130P​

High Powered Performance, 130KV, Compact X-Ray System

Features

  • BGA Inspection/Analysis
  • Counterfeit Inspection
  • Porosity/Voiding Detection
  • Medical Device Inspection
  • Wire Bond Inspection
  • LED Inspection
  • Less Than 1 uSv/hr (0.1 mR/hr) USFDA 21 CFR-1, 1000, 1020.40