Features
- Suitable for the cleaning or flux residues before molding of high-capacity PBGA, Flip-Chip, SIP, Lead Frame, IC substrate and other device
SAM
SAM · Cleaning Solution
541 · SAM
SM-6700
SAM
Cleaning Solution
Available
Features
- Suitable for the cleaning or flux residues before molding of high-capacity PBGA, Flip-Chip, SIP, Lead Frame, IC substrate and other device
SM-6700.pdf
